Issue 006 · 3–9 August 2026
SK hynix KRW 54.3T Yongin Y2 and Cheongju M17 fabs, SpaceX–Tesla $16.8B Texas Terafab, Samsung 400-layer V10 NAND and US Section 232 polysilicon tariffs
SK hynix $38.3B capex through 2031 · SpaceX–Tesla AI-chip complex · US polysilicon Section 232 protection · Samsung V10 BV-NAND vertically integrated AI memory · SK hynix–Sandisk Open HBF specification
Issue 005 · July 27–August 2, 2026
IonQ acquires SkyWater foundry, Samsung record KRW 89.5T profit, SK hynix HBM4 mass shipments and Lam Research record $6.72B revenue
IonQ–SkyWater US-only foundry vertical integration · Samsung Q2 record · SK hynix 76% operating margin · Lam Research September guide up · HBM4 mass production begins
Issue 004 · July 20–26, 2026
Samsung–Broadcom $200B+ strategic collaboration, Amkor–NVIDIA $1.5B and Intel glass-based packaging
Samsung–Broadcom $200B+ memory & foundry collaboration · Amkor–NVIDIA $1.5B advanced-packaging deal · Intel–Lens glass packaging · Intel–Fortinet SP6 security processor
Issue 003 · July 13–19, 2026
TSMC raises US investment to $265B, Micron $22B auto supply deals and Intel €5B Ireland
TSMC $265B US expansion · Micron $22B automotive memory supply commitments · Intel €5B Leixlip campus · ASML €43–45B guidance · SEMI $165.9B equipment market forecast
Issue 002 · July 6–12, 2026
SK hynix Nasdaq ADR, Micron $250B and CXMT IPO
SK hynix raises US$26.5B via Nasdaq ADR · Micron expands US commitment beyond $250B · CXMT launches 29.5B yuan STAR Market IPO · Micron–Ford automotive supply agreement
Issue 001 · June 29–July 5, 2026
India OSAT, Dresden power fab and Korea AI memory
CG Semi OSAT commissioned in Sanand · Infineon opens €5B Dresden Smart Power Fab · Micron-GM automotive memory agreement · South Korea 800T won AI-chip and HBM mega-project
Issue 001 · June 29–July 5, 2026
Global fabs, OSAT and AI memory investment
CG Semi's Sanand OSAT commissioning · Infineon's €5B Dresden Smart Power Fab · Micron-GM automotive memory agreement · Samsung/SK Hynix 800T won AI-chip mega-project
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